Honeywell Electronic Materials announced it will more than double its refining and casting capacity for high-purity copper and tin at its Spokane, Wash., facility in response to rising demand in the semiconductor industry.
Demand for the copper material has been steadily growing as new advanced chip designs continue to require high-purity copper. Additional industry growth has come as memory manufacturers transition from aluminum to copper. The use of copper and tin for advanced chip packaging applications is similarly on the rise.
The first phase of the capacity expansion will be complete in the first quarter of next year, while the second phase is expected to be completed by the middle of next year.
For more information, read the press release.
